The global organic substrate packaging materials market reached a size of USD 15.60 billion in 2023 and is projected to grow to USD 28.41 billion by 2034, with a compound annual growth rate (CAGR) of 5.60% from 2025 to 2034.
Organic substrate packaging materials are used as the base film in printed circuit boards (PCBs) to provide reliable electrical performance and high durability. These materials help reduce the overall weight of PCBs and enhance their dimensional stability and functionality. In addition, they support minimizing the environmental impact compared to inorganic materials, making them a sustainable choice in the electronics industry. The demand for organic substrate packaging materials has been growing steadily, driven by several key factors.
One of the primary drivers of the organic substrate packaging materials market is the increasing demand for portable electronic devices, which offer convenience and high functionality. As technology in communication devices advances, the need for efficient packaging solutions grows. The rise in demand for miniaturized electronics in industries such as defense, healthcare, and aviation is also contributing significantly to the market’s expansion. Additionally, the burgeoning adoption of self-driving cars is another factor driving growth, as these materials are used in millimeter-wave vehicle radar systems to detect obstacles.
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