The packaging and material technology industry continues to witness groundbreaking innovations aimed at enhancing product performance, sustainability, and efficiency. Recent developments by Gerdau Graphene, Pregis, and onsemi demonstrate how advanced technologies are reshaping traditional approaches across various applications.
On March 27, 2023, Gerdau Graphene unveiled what it claims to be the “first” graphene-enhanced polyethylene (PE) additive masterbatch. This pioneering product is tailored for use in extruded packaging and other versatile applications. By integrating graphene—a material celebrated for its exceptional strength, thermal conductivity, barrier properties, and electrical conductivity—into PE additives, the company aims to significantly elevate the performance of packaging materials.
The inclusion of graphene in the PE additive masterbatch delivers numerous advantages. Enhanced material strength ensures better durability, while superior thermal conductivity and barrier properties improve the packaging’s resistance to external elements. These features make it a highly attractive solution for industries seeking advanced, high-performance materials for their extruded packaging needs.
On March 3, 2023, Pregis, a global leader in protective packaging solutions, launched its AirSpeed Ascent air cushioning system in the European market. This state-of-the-art system is designed to offer efficient, reliable air cushioning for safeguarding products during shipping and handling.
The AirSpeed Ascent utilizes advanced technology to produce on-demand air cushions, ensuring superior The automotive packaging market is projected to witness significant growth from 2025 to 2034. It will grow from USD 9.58 billion in 2025 to USD 15.37 billion by 2034, expanding at a CAGR of 5.4%, driven by innovations and key market players in the automotive sector.protection against impacts, shocks, and vibrations during transit. By minimizing the risk of product damage, this innovation addresses the growing need for reliable protective packaging in e-commerce and logistics. Additionally, the system’s compact design and user-friendly interface make it ideal for diverse packaging environments, from small-scale operations to high-volume fulfillment centers.
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On November 15, 2022, onsemi, a prominent semiconductor solutions provider, introduced a new line of MOSFETs featuring innovative top-cool packaging. This advanced packaging design significantly improves thermal management and overall device performance, marking a major step forward for high-power applications.
The top-cool packaging technology enables more efficient heat dissipation from the MOSFETs, addressing the critical challenge of managing heat in high-power environments. By maintaining optimal operating temperatures, this innovation enhances the reliability and longevity of the MOSFETs, making them a preferred choice for industries that require robust thermal management solutions.
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